- 封測服務(wù)
- package test service
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封裝系列 Package |
封裝厚度 (Max.) |
表面處理 |
應用領(lǐng)域 |
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QFN/DFN/COL |
W: 0.8mm UT: 0.6mm X1: 0.5mm X2:0.4mm X3:0.33mm |
NiPdAu/100% Sn |
電子/通訊/汽車(chē)/智能家具/工業(yè)控制等 |
|
LGA/FLGA |
0.35~1.85mm |
NiPdAu/NiAu |
射頻/加速度計/硅麥/壓力/磁/溫度/光學(xué)傳感器 |
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CSP |
0.5mm;0.6mm |
NiPdAu/NiAu |
濾波器/音頻 |
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SiP |
0.8mm;0.95mm;1.1mm |
NiPdAu/NiAu/ 100% Sn |
電源管理/電流傳感器 |
|
SOP |
2.3 /1.35 mm |
100% Sn |
隔離/電流 |
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